[Example of Problem Solving] System and Set Manufacturers
Examples of narrow-pitch MEMS mounting on flexible substrates and flexible circuit board implementations.
We would like to introduce a case study of our response to system and set manufacturers. Even if you have a concept for an IoT system or set, you may be facing challenges such as not knowing the implementation methods or materials to use, OSAT not being able to accommodate structures other than assembly line setups or small-scale production, and lacking a partner for process development that involves equipment development. As a result, we conducted narrow-pitch MEMS mounting on flexible substrates, flexible substrate mounting, and stress measurement for solder flip chips. [Case Summary (Excerpt)] ■ Narrow-pitch MEMS mounting on flexible substrates - Created flexible substrate design and implemented NCP/ACP mounting - Achieved miniaturization ■ Low-temperature 80℃ flexible substrate mounting *For more details, please refer to the PDF document or feel free to contact us.
- Company:コネクテックジャパン
- Price:Other